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Package Intersil W3x4.12

Package Intersil W3x4.12

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x4.12

3x4 Array 12 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
    W3x4.12
    3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE D SYMBOL MILLIMETERS A 0.445 Min 0.495 Nom 0.545 Max A1 0.190 В±0.025 A2 0.305 В±0.025 E PIN 1 ID
    TOP VIEW A2 A A1 b 0.270 В±0.030 D 1.695 В±0.020 D1 0.400 BASIC E 1.295 В±0.020 E1 0.400 BASIC e 0.400 BASIC SD 0.200 BASIC SE 0 BASIC
    NUMBER OF BUMPS: 12 b Rev. 0 12/08 SIDE VIEW NOTES:
    1. All Dimensions are in Millimeters. b e (E1) SD
    3
    2
    1
    D C B A e (D1)
    BOTTOM VIEW 1 SE ...
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