Package Intersil W3x4.12

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x4.12
Package Intersil W3x4.12

3x4 Array 12 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

PDF, 40 Kb
Docket

Parametrics

FamilyWLCSP-BP
Pin Count12
Length1.70 mm
Width1.30 mm
Thickness0.31 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12

Model Line

Manufacturer's Classification