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Package Intersil W3x4.12C

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x4.12C

12 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x4.12C
    12 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40 PITCH)
    Rev 0, 6/16
    X
    1.39 В±0.030
    Y 0.400 D
    12x 0.265 В±0.035 C 1.69 В±0.030
    B
    0.245
    A
    0.10 1
    TOP VIEW (4X) 2 3 0.400 0.295 PIN 1
    (A1 CORNER)
    BOTTOM VIEW Z
    0.05 Z SEATING PLANE
    3 PACKAGE
    OUTLINE 0.215 0.265
    0.400 0.265 В±0.035 x12
    0.10 M Z X Y
    0.05 M Z 6 NSMD
    0.200 В±0.030
    RECOMMENDED LAND PATTERN 0.500 В±0.050 SIDE VIEW NOTES: ...
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