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Package Intersil W3x5.15A

Package Intersil W3x5.15A

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x5.15A

15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x5.15A
    15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
    Rev 0, 7/14 X 1.51 В±0.030 0.800 Y 0.400
    E
    15X 0.265 В±0.035
    2.15 В±0.030 D
    1.600 C
    B (4X) 0.275 A 0.10 1 2 3 PIN 1
    (A1 CORNER) 0.355 TOP VIEW BOTTOM VIEW 0.05 Z PACKAGE OUTLINE
    0.240 SEATING PLANE
    3 0.040 BSC
    (BACKSIDE COATING)
    0.290 0.400
    0.265 В±0.035 15X
    0.10 M Z X Y
    0.05 M Z 0.200 В±0.030
    0.540 В±0.050
    RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical ...
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