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Package Intersil W4x3.10A

Package Intersil W4x3.10A

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x3.10A

4x3 Array 10 Ball Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Wafer Level Chip Scale Package (WLCSP) W4x3.10A
    4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID SYMBOL MILLIMETERS NOTES A 0.64 +0.05 -0.10 -A1 0.29 ±0.02 -D TOP VIEW bb A2 A
    A1
    b A2 0.35 REF. -b θ 0.37 ±0.03 -bb θ 0.30 REF. -D 1.50 ±0.05 -D1 1.00 BASIC -E 2.00 ±0.05 -E1 1.50 BASIC -e 0.50 BASIC -SD 0.00 BASIC -SE 0.25 BASIC -N 10 3
    Rev. 1 10/05 SIDE VIEW NOTES:
    1. Dimensions are in Millimeters.
    2. Dimensioning and tolerancing conform to ASME 14.5M-1994. E1 3. Symbol “N” is the actual number of solder balls.
    e SE
    C
    B SD A
    1 3 2 BOTTOM VIEW 1 4 b D1 ...
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