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Package Intersil W4x4.16C

Package Intersil W4x4.16C

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x4.16C

4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x4.16C
    (WLCSP 0.5mm PITCH) WAFER LEVEL CHIP SCALE PACKAGE
    Rev 1, 05/14
    1.500
    X Y 2.160 ±0.030 0.500 D C 16x 0.320 ±0.030 2.160 ±0.030
    B A
    0.330
    (4X) 1 PIN 1
    (A1 CORNER) 0.10 2 4 3 0.330 0.250
    TOP VIEW BOTTOM VIEW Z
    SEATING PLANE
    0.05 Z
    PACKAGE
    OUTLINE 0.280 0.330
    0.500
    0.320 ±0.030
    Ø0.10 M Z X Y
    Ø0.05 M Z 3 NSMD
    0.240 ±0.030 RECOMMENDED LAND PATTERN
    0.600 ±0.06mm
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters. ...
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