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Package Intersil W4x4.16F

Package Intersil W4x4.16F

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x4.16F

16 BALL WLCSP WITH 0.4mm PITCH (BSC) 4x4 ARRAY (1.740mm x 1.740mm)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x4.16F
    16 BALL WLCSP WITH 0.4mm PITCH (BSC) 4x4 ARRAY (1.740mm x 1.740mm)
    Rev 0, 1/14 X 0.400 1.740В±0.030 Y D
    1.740В±0.030 16x 0.265В±0.035 C
    B
    A (4X) 0.270 0.10
    1
    0.200 2 3 4
    0.270 PIN 1 (A1 CORNER
    TOP VIEW BOTTOM VIEW Z PACKAGE OUTLINE 0.05 Z SEATING PLANE
    3 0.040 BSC
    (BACK SIDE COATING) 0.240 0.290
    0.400
    0.265В±0.035
    0.10
    0.05 ZXY
    Z 0.200В±0.030 TYPICAL RECOMMENDED LAND PATTERN
    0.540В±0.050
    SIDE VIEW NOTES:
    1. Dimension and tolerance per ASMEY14.5M -1994. 2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z . 1 3. Primary datum Z and seating plane are defined by the spherical
    crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between ...
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