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Package Intersil W4x5.20

Package Intersil W4x5.20

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20

4x5 Array 20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20 4x5 Array 20 Ball Wafer Level Chip Scale Package (WLCSP)
    Rev 1 8/09
    2.545 В± 0.02 X 2.00
    20X 0.32 В± 0.03 Y 4
    0.25
    3
    1.50 2.045 В± 0.02
    2
    1
    0.50 0.10 PIN 1 (A1 CORNER) TOP VIEW E D C B A (4X)
    0.50
    BOTTOM VIEW PACKAGE OUTLINE 0.33 3
    0.025 BSC
    0.30 В± 0.015 0.23 В± 0.015 0.32 В± 0.03 SEATING PLANE 0.05 Z 0.10 M Z X Y
    0.05 M Z 0.28 Z SIDE VIEW 0.50 4 NSMD TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994,
    and JESD 95-1 SPP-10. 1 3. Back side coat 0.25mm thick applied to CSP package top. 4. NSMD refers to non-solder mask defined pad design per
    Intersil tech brief www.intersil.com/data/tb/TB451.pdf ...
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