Package Intersil W4x5.20A

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20A
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 1, 1/12
1.200 X
1.595В±0.02 Y 0.400 5
0.400
4 20x 0.270В±0.03 3 2.335В±0.02 1.600 2
1
0.367
(4X) 0.10 A TOP VIEW B C D
0.197 0.200
PIN 1 (A1 CORNER)
BOTTOM VIEW Z
0.05 Z 3
SEATING PLANE PACKAGE OUTLINE
0.225 0.300В±0.025 0.400 0.270В±0.03 0.275 0.10
0.05 ZXY
Z 0.175В±0.03
0.530 MAX
TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter …