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Package Intersil W4x5.20A

Package Intersil W4x5.20A

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20A

20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20A
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 1, 1/12
    1.200 X
    1.595В±0.02 Y 0.400 5
    0.400
    4 20x 0.270В±0.03 3 2.335В±0.02 1.600 2
    1
    0.367
    (4X) 0.10 A TOP VIEW B C D
    0.197 0.200
    PIN 1 (A1 CORNER)
    BOTTOM VIEW Z
    0.05 Z 3
    SEATING PLANE PACKAGE OUTLINE
    0.225 0.300В±0.025 0.400 0.270В±0.03 0.275 0.10
    0.05 ZXY
    Z 0.175В±0.03
    0.530 MAX
    TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter ...
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