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Package Intersil W4x5.20B

Package Intersil W4x5.20B

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20B

20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20B
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 2, 9/12
    1.200 X
    1.82В±0.03 PIN 1
    (A1 CORNER) Y 0.400 A
    0.400
    B 20x 0.265 В± 0.03 C 2.15В±0.03 1.600 D
    E
    (2X) 0.10
    4 3 2 1 0.200
    TOP VIEW
    BOTTOM VIEW Z
    0.05 Z SEATING PLANE
    3 PACKAGE OUTLINE
    0.225 0.305 В± 0.025 0.400 0.265В±0.035 0.275 0.15
    0.05 ZXY
    Z 0.200В±0.03
    0.500В±0.045
    TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter ...
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