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Package Intersil W4x5.20E

Package Intersil W4x5.20E

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20E

20 Ball Wafer Level Chip Scale Package (WLCSP)(BSC)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20E
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (BSC)
    Rev 1, 1/13
    1.200 X Y 1.82В±0.030 0.400 E 20x 0.265В±0.035
    2.15В±0.030 D C 1.600 B 0.275 A
    (4X) 0.10
    1 2 4 3 0.310 TOP VIEW 0.200 PIN 1
    (A1 CORNER) BOTTOM VIEW Z
    0.05 Z PACKAGE
    OUTLINE
    0.240 SEATING PLANE
    3 0.040 BSC
    (BACK SIDE COATING)
    0.290 0.400 0.265В±0.035
    0.10
    0.05 ZXY
    Z 0.200В±0.030
    RECOMMENDED LAND PATTERN 0.540В±0.050
    SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z . ...
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