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Package Intersil W4x5.20G

Package Intersil W4x5.20G

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20G

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20G
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 11/13 1.200
    X Y 0.400 1.67В±0.030
    E
    D 20x 0.265В±0.035 C 2.07В±0.030 1.600 B 0.235 A
    (4X) 0.10 1
    0.200
    TOP VIEW 2 3 4
    0.235 PIN 1
    (A1 CORNER) BOTTOM VIEW Z PACKAGE
    OUTLINE 0.05 Z SEATING PLANE
    3 0.240
    0.040 BSC
    (BACK SIDE COATING)
    0.400
    0.290
    0.265В±0.035 x20
    0.10
    0.05 ZXY
    Z 0.200В±0.030
    RECOMMENDED LAND PATTERN 0.540В±0.050 ...
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