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Package Intersil W4x5.20K

Package Intersil W4x5.20K

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20K

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20K
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 8/14
    1.200 X Y 1.82В±0.030 0.400 E 20x 0.265В±0.035
    2.15В±0.030 D C 1.600 B 0.275 A
    (4X) 0.10
    1 2 4 3 0.310 TOP VIEW 0.200 PIN 1
    (A1 CORNER) BOTTOM VIEW Z
    0.05 Z PACKAGE
    OUTLINE SEATING PLANE
    3 0.240 0.290
    0.400 0.265В±0.035
    0.10
    0.05 ZXY
    Z 0.200В±0.030
    RECOMMENDED LAND PATTERN 0.500В±0.050
    SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical
    crowns of the bump. ...
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