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Package Intersil W4x5.20M

Package Intersil W4x5.20M

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20M

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20M
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 01/15
    X
    Y 0.400 1.74 В±0.030 20x 0.265 В±0.035 E
    D
    C 2.15 В±0.030 B
    A
    (4X) 0.10
    PIN 1
    (A1 CORNER) TOP VIEW 0.275
    1 2 3 4 0.200 0.270
    BOTTOM VIEW 0.240 Z PACKAGE
    OUTLINE 0.05 Z SEATING PLANE
    3 0.400
    0.290 2
    0.265 В±0.035 x20
    0.10
    0.05
    4 0.200 В±0.030 6 NSMD
    RECOMMENDED LAND PATTERN 0.500 В±0.050
    SIDE VIEW NOTES: ...
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