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Package Intersil W4x5.20N

Package Intersil W4x5.20N

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20N

20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) (With BSC)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20N
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) (With BSC)
    Rev 0, 2/15 X 0.400 1.74 В±0.030 Y E
    20x 0.265 В±0.035 D
    C 2.15 В±0.030 B
    A
    (4X) 0.10
    TOP VIEW 0.275
    1 PIN 1
    (A1 CORNER) 2 3 4 0.200
    0.270
    BOTTOM VIEW Z
    0.05 Z
    0.240 PACKAGE OUTLINE SEATING PLANE
    3 0.040 (BSC)
    (BACKSIDE COATING) 0.400
    0.290
    2
    0.265 В±0.035 x20
    0.10
    0.05 Z X Y
    Z 4 0.200 В±0.030 6 NSMD ...
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