Package Intersil W4x5.20R

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20R
Package Intersil W4x5.20R

20 I/O Ultra Thin Wafer Level Chip Scale Package (No Solder Ball) 0.4mm pitch

Package Outline Drawing (POD)

PDF, 106 Kb
Docket

Parametrics

FamilyWLCSP-TKCURDL
Pin Count20
Length2.15 mm
Width1.74 mm
Thickness0.23 mm
Height max0.25 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X5.20R

Model Line

Manufacturer's Classification