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Package Intersil W4x5.20R

Package Intersil W4x5.20R

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20R

20 I/O Ultra Thin Wafer Level Chip Scale Package (No Solder Ball) 0.4mm pitch

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20R
    20 I/O ULTRA THIN WAFER LEVEL CHIP SCALE PACKAGE (NO SOLDER BALL) WLCSP 0.4mm pitch
    Rev 0, 12/16 X
    Y 0.400 1.74 В±0.030 E
    20X 0.240 В±0.005
    2.15 В±0.030 D
    C B
    A
    0.275
    (4X) 0.10 1
    TOP VIEW PIN 1
    (A1 CORNER) 2 3 4 0.200
    0.270
    BOTTOM VIEW 0.240 В±0.005
    2 NOTES:
    1. Dimensions and tolerance per ASMEY 14.5 -1994.
    2. I/O position designation per JESD 95-1, SPP-010.
    3. All dimensions are in millimeters. 1 0.228 В±0.020
    SIDE VIEW ...
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