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Package Intersil W4x5.20S

Package Intersil W4x5.20S

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x5.20S

20 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x5.20S
    20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 12/16
    1.200 X 1.595 В±0.030 Y 0.400 5
    0.400
    20X 0.265 В±0.035 4
    3 2.335 В±0.030 1.600 2
    1
    0.367
    (4X) 0.10 A
    PIN 1 (A1 CORNER)
    TOP VIEW B C D
    0.197 0.200
    BOTTOM VIEW Z
    0.05 Z PACKAGE
    OUTLINE 0.225 3
    SEATING PLANE 0.400
    0.275
    2
    0.265 В±0.035 0.10
    0.05
    4 6 NSMD 0.200 В±0.030 TYPICAL RECOMMENDED LAND PATTERN 0.500 В±0.050 ...
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