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Package Intersil W4x6.24

Package Intersil W4x6.24

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x6.24

4x6 Array 24 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x6.24 4X6 ARRAY 24 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 1, 9/10
    1.60± 0.02 24X 0.270 ± 0.03 1.20 PIN A1
    F
    E
    D
    2.40± 0.02 2.00
    C
    B
    0.40
    A
    1 TOP VIEW 2 3 4 BOTTOM VIEW
    0.305 ± 0.025
    0.55 mm MAX Z SEATING PLANE 0.19 ± 0.03 0.27 ± 0.03 0.05 Z Ø0.10 M Z X Y
    Ø0.05 M Z
    SIDE VIEW 0.275 PACKAGE
    OUTLINE
    NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5M-1994,
    and JESD 95-1 SPP-010.
    3. NSMD refers to Non-solder Mask Defined pad design per ...
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