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Package Intersil W4x7.28

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x7.28

28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W4x7.28
    28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
    Rev 0, 04/16
    Y X 1.660 В±0.030 0.400
    G
    28x 0.265 В±0.035 F
    E 2.860 В±0.030 D
    C
    B
    A (4X) 0.23
    1 0.10 2 3 4 0.200 PIN 1
    (A1 CORNER) 0.23 TOP VIEW BOTTOM VIEW 0.05 Z PACKAGE OUTLINE 0.215 Z SEATING PLANE
    3 0.400
    0.265 2
    0.265 В±0.035
    0.10 M Z X Y
    0.05 M Z
    4 NSMD 0.200 В±0.030 6 NSMD
    RECOMMENDED LAND PATTERN 0.500 В±0.050
    SIDE VIEW NOTES:
    1.
    2. ...
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