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Package Intersil W5x5.25

Package Intersil W5x5.25

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x5.25

5x5 Array 25 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x5.25
    5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 1, 2/13
    2.000 2.600 В±0.030 X 25X 0.320 В± 0.030 Y E
    D
    2.600 В±0.030
    C
    B
    0.500
    A
    0.10
    (4X) 0.300
    1 PIN 1 (A1 CORNER) 2 3 4 5 0.500 TOP VIEW 0.300
    BOTTOM VIEW PACKAGE OUTLINE 0.330 0.280 0.540В±0.040mm 0.500 0.240 В± 0.030 0.320 В± 0.030 X25
    0.10
    0.05 3 NSMD ZXY
    Z TYPICAL RECOMMENDED LAND PATTERN Z SEATING
    PLANE
    0.05 Z SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5M-1994,
    and JESD 95-1 SPP-010. ...
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