RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil W5x5.25B

Package Intersil W5x5.25B

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x5.25B

5x5 Array 25 Ball With 0.40 Pitch Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

  • Download », PDF, 113 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x5.25B
    5X5 ARRAY 25 BALL WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 2, 12/11
    X Y 1.60 2.11В±0.03
    25x 0.225В±0.03
    E
    D
    0.40 2.13В±0.03 1.60 C
    B 0.265 A 0.10
    PIN 1 (A1 CORNER) (4X)
    TOP VIEW 1 2 3 4 0.254 5
    0.40 BOTTOM VIEW 0.25 PACKAGE
    OUTLINE 0.305В±0.025
    0.225
    0.55 MAX
    0.40 Z SEATING PLANE 0.19В±0.03
    3 0.25В±0.03 NSMD TYPICAL RECOMMENDED LAND PATTERN 0.10
    0.05 ZXY
    Z 0.05 Z SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5M-1994,
    and JESD 95-1 SPP-010. ...
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus