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Package Intersil W5x5.25E

Package Intersil W5x5.25E

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x5.25E

5X5 ARRAY 25 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (With BSC)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x5.25E
    5X5 ARRAY 25 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (With BSC)
    Rev 0, 1/14 Y X 2.070 В± 0.030 25x 0.265 В± 0.035 E
    D
    1.600 C 2.330 В± 0.030 B
    0.400
    A
    0.365
    0.10 1 (4X) 2 3 4 5 0.400 PIN 1 (A1 CORNER)
    TOP VIEW 0.235
    BOTTOM VIEW SEATING PLANE Z 3 0.05 Z
    PACKAGE OUTLINE
    0.240 0.0400 BSC
    (BACK SIDE COATING) 0.400 0.265 В± 0.035 0.10
    0.05 0.290 ZXY
    Z 3 NSMD
    0.200 В± 0.03
    TYPICAL RECOMMENDED LAND PATTERN
    0.540 В± 0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimension and tolerance per ASMEY 14.5M-1994, ...
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