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Package Intersil W5x5.25G

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x5.25G

5x5 Array 25 Balls with 0.4mm Pitch Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x5.25G
    5x5 ARRAY 25 BALLS WITH 0.4mm PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 12/16
    X
    2.34 В±0.030 Y 0.400 E
    25X 0.265 В±0.035 D
    C 2.38 В±0.030 B
    A
    (4X) 0.390 0.10
    1 PIN 1
    (A1 CORNER) 2 3 4 5 0.0
    0.370 TOP VIEW
    BOTTOM VIEW 0.05 Z SEATING PLANE
    3 PACKAGE
    OUTLINE 0.215 Z 0.265 0.265 В±0.035 0.400 0.10
    0.05 4
    Z X Y
    Z
    5 0.200 В±0.030
    6. NSMD RECOMMENDED LAND PATTERN 0.500 В±0.050
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters. ...
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