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Package Intersil W5x5.25H

Part NumberW5x5.25H

5x5 array 25 balls, 0.4mm Pitch Ultra-Thin WLCSP with 150um Si Thickness

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    5x5 Array 25 Balls, 0.4mm Pitch Ultra-Thin Wafer Level Chip Scale Package (WLCSP) with 150Вµm Si Thickness
    Rev 0, 8/17 ...
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