RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil W5x6.30A

Package Intersil W5x6.30A

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x6.30A

5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) BSC

Package Outline Drawing (POD)

  • Download », PDF, 89 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x6.30A
    5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) BSC
    Rev 0, 6/13
    1.600 X Y 2.330В±0.030 0.400
    F
    E 30x 0.265В±0.035 D
    2.000 2.610В±0.030
    C
    B
    A 0.305
    (4X) 0.10 1 2 3 4 5 0.400 PIN 1 (A1 CORNER)
    TOP VIEW 0.365 BOTTOM VIEW Z
    0.05 Z PACKAGE OUTLINE
    0.240 SEATING PLANE
    3 0.040 BSC
    (BACK SIDE COATING) 0.290 0.400 0.265В±0.035 30x
    0.10 M Z X Y
    0.05 M Z
    0.200В±0.030
    TYPICAL RECOMMENDED LAND PATTERN
    0.540В±0.050 SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994. ...
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus