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Package Intersil W5x6.30C

Package Intersil W5x6.30C

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x6.30C

5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x6.30C
    5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 6/14
    1.600 X Y 2.330В±0.030 0.400
    F
    E 30x 0.265В±0.035 D
    2.000 2.610В±0.030
    C
    B
    A 0.305
    (4X) 0.10 1 2 3 4 5 0.400 PIN 1 (A1 CORNER)
    TOP VIEW 0.365 BOTTOM VIEW Z
    0.05 Z PACKAGE OUTLINE SEATING PLANE
    3 0.240 0.290 0.400 0.265В±0.035 30x
    0.10 M Z X Y
    0.05 M Z
    0.200В±0.030
    TYPICAL RECOMMENDED LAND PATTERN
    0.500В±0.050 SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z. ...
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