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Package Intersil W5x7.28

Package Intersil W5x7.28

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x7.28

28 Ball Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x7.28
    28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
    Rev 0, 7/12
    1.600 X
    2.185В±0.02 Y 0.800 G G F F E E 0.400 2.92В±0.02 (2X) 0.10 5 4 3 2 28X 0.260В±0.03 D D C C B B A A 1.600
    2.400 1 1 2 5
    4
    0.400 3 PIN 1 (A1 CORNER)
    TOP VIEW BOTTOM VIEW
    PACKAGE
    OUTLINE
    0.225 0.400
    0.275 0.305В±0.025 0.505В±0.40 0.200В±0.03
    0.400 TYPICAL RECOMMENDED LAND PATTERN SEATING
    PLANE
    0.05 Z
    Z 0.260В±0.03
    0.050
    0.015 ZXY
    Z SIDE VIEW
    NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994. ...
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