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Package Intersil W5x7.35

Package Intersil W5x7.35

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x7.35

35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x7.35
    35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
    Rev 0, 11/14
    0.400 X Y 2.14В±0.030 G
    F 35x0.265В±0.035 E
    D 2.88 В±0.030 C
    B 0.240 A
    (4X) 0.10 1 TOP VIEW 2 3 4 5 0.005 PIN 1 (A1 CORNER) 0.275 0.265
    BOTTOM VIEW Z
    0.240 0.05 Z PACKAGE OUTLINE SEATING PLANE
    3 0.290 2
    0.265В±0.035
    0.10
    0.05 0.400 4 6 NSMD 0.200В±0.030 RECOMMENDED LAND PATTERN
    0.500В±0.050
    SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
    4. Bump position designation per JESD 95-1, SPP-010.
    5. All dimensions are in millimeters.
    6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 ZXY ...
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