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Package Intersil W5x7.35C

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x7.35C

35 Ball Wafer Level Chip Scale Package (WLCSP 0.5mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x7.35C
    35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm PITCH)
    Rev 0, 12/16
    X Y 2.551 В±0.030 0.500 35x 0.320 В±0.03 G
    F
    E 3.670 В±0.030 D
    C
    B
    A (4X) 0.10 PIN 1
    (A1 CORNER) 2 1 3 0.335 5 4 0.276 0.500 TOP VIEW BOTTOM VIEW Z
    0.300 0.05 Z PACKAGE
    OUTLINE SEATING PLANE
    3 0.500 4
    0.320 В±0.030
    0.10 Z X Y 0.05 Z
    5 0.250 0.240 В±0.030 6
    RECOMMENDED LAND PATTERN 0.600 В±0.060
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASME Y14.5 -1994.
    3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
    4. Dimension is measured at the maximum bump diameter parallel to primary datum Z . ...
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