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Package Intersil W6x6.36B

Package Intersil W6x6.36B

ManufacturerIntersil
SeriesWLCSP
Part NumberW6x6.36B

36 Ball Wafer Level Chip Scale Package (WLCSP 0.35mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W6x6.36B
    36 Ball Wafer Level Chip Scale Package (WLCSP 0.35mm Pitch)
    Rev 0, 1/16
    X 2.439 В±0.030 0.350 Y 36x 0.241 В±0.030 F
    E
    D
    2.439 В±0.030
    C
    B 0.3445 A
    (4X) 0.10 1
    PIN 1
    (A1 CORNER) 2 5 4 6 0.1750 0.3445 BOTTOM VIEW TOP VIEW 0.250 3 Z PACKAGE
    OUTLINE SEATING PLANE 0.05 Z 3 0.35 0.244 В±0.030
    0.10
    0.05 0.200
    0.164 NOMINAL
    0.364 В±0.0125
    0.200 NOMINAL 6 NSMD
    RECOMMENDED LAND PATTERN NOTES:
    1.
    2.
    3. ...

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