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Package Intersil W6x7.42

Package Intersil W6x7.42

ManufacturerIntersil
SeriesWLCSP
Part NumberW6x7.42

42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W6x7.42
    42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm PITCH)
    Rev 0, 2/15
    X
    Y 0.400 2.80 В±0.030 G
    42x 0.265 В±0.035 F
    E 3.20 В±0.030 D
    C
    B 0.400 A
    1 0.10 (4X) PIN 1 (A1 CORNER) 2 4 5 6 0.200 TOP VIEW 0.400
    BOTTOM VIEW Z PACKAGE
    OUTLINE 0.240 3 0.05 Z SEATING PLANE
    3 0.290
    2
    0.400 6 NSMD 0.200 В±0.030
    0.500 В±0.050 TYPICAL RECOMMENDED LAND PATTERN
    SIDE VIEW NOTES:
    1.
    2.
    3.
    4.
    5. ...
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