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Package Intersil W7x8.46

Package Intersil W7x8.46

ManufacturerIntersil
SeriesWLCSP
Part NumberW7x8.46

7x8 Array 46 Balls With 0.40 Pitch Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W7x8.46
    7X8 ARRAY 46 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
    Rev 0, 11/12
    2.400
    2.820В±0.030 1.600 X 0.400 Y
    H PRELIMINARY
    G 0.200 F E 3.310В±0.030 2.000 D 2.800 C
    B
    A
    (4X) 0.10 1 TOP VIEW 2 3 4 5 6 7 BOTTOM VIEW
    PIN 1
    (A1 CORNER) 0.290 PACKAGE
    OUTLINE 0.400 0.240 0.550 MAX 0.200В±0.030 0.265В±0.035 x 46
    0.10
    ZXY
    0.05
    Z Z SEATING
    0.05 Z PLANE SIDE VIEW NOTES:
    3 NSMD 1. All dimensions are in millimeters. TYPICAL RECOMMENDED LAND PATTERN 2. Dimension and tolerance conform to ASMEY14.5-1994,
    and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per
    Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf 1 ...
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