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Package Intersil W7x8.56

Package Intersil W7x8.56

ManufacturerIntersil
SeriesWLCSP
Part NumberW7x8.56

56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W7x8.56
    56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
    Rev 0, 7/13
    X Y 2.400
    3.110В±0.030
    H
    G
    56x
    0.265В±0.035 F
    E
    2.800 3.210В±0.030
    D
    0.400
    C
    B 0.205 A
    (4x) 0.10 1
    PIN 1 (A1 CORNER) 2 3 4 5 6 7
    0.355 0.400 TOP VIEW BOTTOM VIEW PACKAGE OUTLINE 0.05 Z Z SEATING PLANE
    3 0.240 0.290
    0.265В±0.035 56x
    0.10 M Z X Y
    0.05 M Z 0.400 0.200В±0.030 ...
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