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Package Intersil W8x12.96

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x12.96

96 Ball Wafer Level Chip Scale Package (WLCSP 0.5mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W8x12.96
    96 Ball Wafer Level Chip Scale Package (WLCSP 0.5mm Pitch)
    Rev 0, 10/15
    4.025 В±0.030 X
    Y 0.500
    96x0.320 В±0.03 M
    L
    K
    J
    H
    G 6.105 В±0.030 F
    E
    D
    C
    B
    A 0.10 (4x) PIN 1 1 2 3 4 5 6 7 8 0.250 TOP VIEW BOTTOM VIEW Z
    PACKAGE
    OUTLINE 0.300 SEATING PLANE 0.05 Z 0.500 0.320 В±0.030 88x
    0.10
    0.05
    0.250
    6 NSMD ...
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