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Package Intersil W8x9.72B

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x9.72B

72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W8x9.72B
    72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
    Rev 0, 12/15
    X 3.608 В±0.030 Y 0.400
    J
    72x 0.265 В±0.035 H
    G
    F 4.009 В±0.030 E
    D
    C
    0.405 B
    A
    (4X) 0.10 1
    PIN 1 (A1 CORNER) 2 4 5 6 7 8
    0.404 0.200 TOP VIEW BOTTOM VIEW Z
    PACKAGE
    OUTLINE 0.215 3 0.05 Z SEATING PLANE
    3 0.400
    0.265 0.265 В±0.035 6 NSMD Z X Y 0.05 Z 0.200 В±0.030
    0.500 В±0.050 RECOMMENDED LAND PATTERN NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance and tolerance per ASMEY 14.5 -1994. ...
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