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Package Intersil W8x9.72C

Package Intersil W8x9.72C

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x9.72C

72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    1. Package Outline Drawing W8x9.72C
    72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
    Rev 0, 10/17 TB451 ...
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