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Package Intersil W9x12.108

Package Intersil W9x12.108

ManufacturerIntersil
SeriesWLCSP
Part NumberW9x12.108

108 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W9x12.108
    108 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
    Rev 0, 1/16
    X 4.00 В±0.030 Y 0.400
    M
    108x 0.265 В±0.035 L
    K
    J
    H
    G 5.20 В±0.030 F
    E
    D
    C
    0.400 B
    A
    (4X) 0.10 1
    PIN 1
    (A1 CORNER) TOP VIEW 2 3 4 5 6 7 8 9
    0.400 0.400
    BOTTOM VIEW PACKAGE OUTLINE 0.215 0.05 Z Z SEATING PLANE
    3 0.400 0.265 В±0.035
    0.10 M Z X Y ...
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