RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil L8.2x3B

Package Intersil L8.2x3B

ManufacturerIntersil
SeriesX2DFN
Part NumberL8.2x3B

8 Lead Extreme Thin Dual Flat No-Lead Plastic Package (XDFN)

Package Outline Drawing (POD)

  • Download » PDF, 87 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x3B
    8 LEAD EXTREME THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (XDFN)
    Rev 2, 05/15
    0 . 50 BSC 2 . 00 BSC 4 b A
    1 B 0.10 M C A B 4 6 PIN 1 INDEX AREA 0.15 8 0.4 В± 0.1 (4X) 3 . 00 BSC 6 1.45 + 0.1/ -0.15 PIN 1 INDEX AREA TOP VIEW 5
    1.35+0.1/ -0.15 BOTTOM VIEW
    PACKAGE OUTLINE
    ( 6 x 0.50 BSC )
    ( 8 x 0.25 ) DETAIL "X"
    0.10 C C 0.31 ~ 0.40
    SEATING
    PLANE
    0.08 C ( 1.45 ) SIDE VIEW ( 1.35 ) TYPICAL RECOMMENDED LAND PATTERN 0 . 127 REF 0 . 00 MIN.
    0 . 05 MAX. ( 8 X 0.60 ) ( 8 x 0.20 ) C DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05
    4. Dimension b applies to the metallized terminal and is measured
    between 0.18mm and 0.30mm from the terminal tip.
    5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). ...

Parametrics

FamilyX2DFN
Pin Count8
Width3.00 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X3B

Moldel Line

Series: X2DFN (1)
  • L8.2x3B

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus