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Package Intersil L28.4x5D

Package Intersil L28.4x5D

ManufacturerIntersil
SeriesX2QFN
Part NumberL28.4x5D

28 Lead Super Thin Quad Flat No Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L28.4x5D
    28 LEAD SUPER THIN QUAD FLAT NO LEAD PLASTIC PACKAGE
    Rev 0, 3/11
    PIN 1
    INDEX AREA 4.00 A 0.25 MIN
    B 0.400 В± 0.10
    23 PIN #1
    INDEX AREA 28 22 1 0.50
    3.6 +0.10/-0.15
    EXP DAP 5.00 0.20 В±0.05
    8 15 0.10
    0.05 4
    CAB
    C 0.05 C 4x 14 9
    2.60 +0.10/0.15
    EXP DAP TOP VIEW BOTTOM VIEW SEE DETAIL “X''
    0.10 C 5 0.38 +0.02/-0.08
    0.08 C C C 0.00 MIN
    0.05 MAX 0.127 REF SEATING PLANE
    SIDE VIEW DETAIL "X" (3.20) PACKAGE
    BOUNDARY NOTES: 28 x (0.20) (4.20) (3.60) 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension applies to the metallized terminal. If terminal has a 24 x (0.50) radius on its end, dimension should not be measured in that ...

Parametrics

FamilyX2QFN
Pin Count28
Length4.00 mm
Width5.00 mm
Thickness0.38 mm
Height max0.40 mm
Weight0.054 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL28.4X5D

Moldel Line

Series: X2QFN (1)
  • L28.4x5D

Manufacturer's Classification

  • Plastic Packages
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