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Package Intersil L6.1.2x1.0A

Package Intersil L6.1.2x1.0A

ManufacturerIntersil
SeriesuTDFN
Part NumberL6.1.2x1.0A

6 Lead Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
    A E L6.1.2x1.0A B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
    MILLIMETERS PIN 1
    REFERENCE
    2X
    0.10 C
    2X D 0.10 C SYMBOL MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 -A1 -0.05 -0.127 REF A3 TOP VIEW -b 0.15 0.20 0.25 5 D 0.95 1.00 1.05 -E 1.15 1.20 1.25 -DETAIL A
    0.10 C
    A
    7X 0.08 C e
    A1 A3
    SIDE VIEW C
    SEATING
    PLANE 4X
    e DETAIL B
    1 5X
    L 3 0.40 BSC -L 0.30 0.35 0.40 -L1 0.40 0.45 0.50 -N 6 2 Ne 3 3 Оё 0 -12 4 L1 Rev. 2 8/06
    NOTES:
    1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
    6 4 BOTTOM VIEW b 6X
    0.10 C A B
    0.05 C NOTE 3 2. N is the number of terminals. ...

Parametrics

FamilyuTDFN
Pin Count6
Width1.00 mm
Height max0.55 mm
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL6.1.2X1.0A

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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