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Package Intersil L6.1.6x1.6

Package Intersil L6.1.6x1.6

ManufacturerIntersil
SeriesuTDFN
Part NumberL6.1.6x1.6

6 Lead Ultra Thin Dual Flat No-Lead Col Plastic Package (UTDFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L6.1.6x1.6
    6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL)
    Rev 3, 05/15
    2X 1.00 1.60 A 6
    PIN 1
    INDEX AREA PIN #1 INDEX AREA
    6
    B 4X 0.50
    1 3
    5X 0 . 40 В± 0 . 1 1X 0.5 В±0.1 1.60 (4X) 0.15
    4 6 0.10 M C A B TOP VIEW 4 0.25 +0.05 / -0.07
    BOTTOM VIEW ( 6X 0 . 25 ) SEE DETAIL "X"
    ( 1X 0 .70 )
    0.5 В±0.05 0.10 C C BASE PLANE
    (1.4 ) SEATING PLANE
    0.08 C SIDE VIEW ( 5X 0 . 60 ) C 5 0 . 2 REF 0 . 00 MIN.
    0 . 05 MAX.
    DETAIL "X" ( 4X 0 . 5 )
    TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. ...

Parametrics

FamilyuTDFN
Pin Count6
Length1.60 mm
Width1.60 mm
Height max0.55 mm
Weight0.0052 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL6.1.6X1.6

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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