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Package Intersil L6.1.6x1.6A

Package Intersil L6.1.6x1.6A

ManufacturerIntersil
SeriesuTDFN
Part NumberL6.1.6x1.6A

6 Lead Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
    A A E
    6 B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 4 MILLIMETERS D PIN 1
    REFERENCE
    2X
    0.15 C
    1
    2X L6.1.6x1.6A 3 MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 -A1 -0.05 -0.127 REF A3 0.15 C
    A1 TOP VIEW
    e
    1.00 REF
    4 6
    L
    CO.2 D2 SYMBOL b 0.15 0.20 0.25 -D 1.55 1.60 1.65 4 D2 0.40 0.45 0.50 -E 1.55 1.60 1.65 4 E2 0.95 1.00 1.05 -0.50 BSC e
    DAP SIZE 1.30 x 0.76 L
    3 1 b 6X
    0.10 M C A B E2 -0.25 0.30 0.35 Rev. 1 6/06 NOTES:
    1. Dimensions are in mm. Angles in degrees. BOTTOM VIEW 2. Coplanarity applies to the exposed pad as well as the terminals.
    Coplanarity shall not exceed 0.08mm.
    DETAIL A 6X 0.10 C 3. Warpage shall not exceed 0.10mm. 0.08 C 4. Package length/package width are considered as special
    characteristics.
    5. JEDEC Reference MO-229. ...

Parametrics

FamilyuTDFN
Pin Count6
Length1.60 mm
Width1.60 mm
Height max0.55 mm
Weight0.0036 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL6.1.6X1.6A

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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