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Package Intersil L8.2x2B

Package Intersil L8.2x2B

ManufacturerIntersil
SeriesuTDFN
Part NumberL8.2x2B

8 Lead Micro Thin Dual Flat No-lead Plastic Package (TDFN) with E-PAD

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x2B
    8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (µTDFN) WITH E-PAD
    Rev 1, 5/15
    2.00 A 6
    PIN #1
    INDEX AREA B 6
    PIN 1
    INDEX AREA 8 1 0.50
    2.00 1.60±0.050
    EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050 ( 8x0.30 )
    0.90±0.050
    EXP. DAP TOP VIEW BOTTOM VIEW SEE DETAIL "X" ( 8x0.20 )
    PACKAGE
    OUTLINE 0.10 C 0 . 55 MAX ( 8x0.30 ) C BASE PLANE
    SEATING PLANE SIDE VIEW ( 6x0.50 ) 1.60 2.00 C
    ( 8x0.25 ) 0.08 0 . 2 REF 0.90
    0 . 00 MIN. 2.00 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 indentifier may be
    either a mold or mark feature. C ...

Parametrics

FamilyuTDFN
Pin Count8
Height max0.55 mm
Weight0.0060 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X2B

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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