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Package Intersil L12.2.2x1.4A

Package Intersil L12.2.2x1.4A

ManufacturerIntersil
SeriesuTQFN
Part NumberL12.2.2x1.4A

12 Lead Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
    L12.2.2x1.4A
    D
    6
    INDEX AREA
    2X A B 12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
    PACKAGE
    MILLIMETERS N E 0.10 C
    1
    2X 2 0.10 C MIN NOMINAL A 0.45 A1 -A3 TOP VIEW 0.10 C
    C A1 A SYMBOL 0.05 C
    LEADS COPLANARITY SIDE VIEW MAX NOTES 0.50 0.55 -0.05 -0.127 REF -b 0.15 0.20 0.25 5 D 2.15 2.20 2.25 -E 1.35 1.40 1.45 -e 0.40 BSC -k 0.20 -L 0.35 0.40 0.45 -N 12 2 Nd 3 3 Ne 3 3 Оё 0 -12 4
    Rev. 0 12/06 NOTES: (DATUM A) 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. PIN #1 ID
    1 2. N is the number of terminals. NX L 2 3. Nd and Ne refer to the number of terminals on D and E side, respectively. e Ne 4. All dimensions are in millimeters. Angles are in degrees. (DATUM B)
    NX b 5
    0.10 M C A B
    0.05 M C Nd
    3 5. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip.
    6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.
    7. Maximum package warpage is 0.05mm. ...

Parametrics

FamilyuTQFN
Pin Count12
Width1.40 mm
Height max0.55 mm
Weight0.0042 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL12.2.2X1.4A

Moldel Line

Series: uTQFN (7)

Manufacturer's Classification

  • Plastic Packages
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