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Package Intersil L20.3.2x1.8

Package Intersil L20.3.2x1.8

ManufacturerIntersil
SeriesuTQFN
Part NumberL20.3.2x1.8

20 Lead Ultra Thin Quad Flat No-lead Plastic Package (UTQFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L20.3.2x1.8
    20 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE (UTQFN)
    Rev 0, 5/08
    1.80 A 6
    PIN #1 ID 16X 0.40
    B
    20 6
    PIN 1 ID# 1 19 2 3.20 0.50В±0.10 (4X) 0.10 9 12
    11 10 VIEW “A-A” TOP VIEW 0.10 M C A B
    0.05 M C 4 20X 0.20
    19X 0.40 В± 0.10
    BOTTOM VIEW ( 1.0 )
    (1 x 0.70)
    SEE DETAIL "X"
    0.10 C MAX 0.55 C BASE PLANE ( 2. 30 ) SEATING PLANE
    0.05 C SIDE VIEW ( 16 X 0 . 40 ) C 0 . 2 REF 5 ( 20X 0 . 20 )
    0 . 00 MIN.
    0 . 05 MAX. ( 19X 0 . 60 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only.
    2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
    3. Unless otherwise specified, tolerance : Decimal В± 0.05 ...

Parametrics

FamilyuTQFN
Pin Count20
Length3.20 mm
Width1.80 mm
Height max0.55 mm
Weight0.0070 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL20.3.2X1.8

Moldel Line

Series: uTQFN (7)

Manufacturer's Classification

  • Plastic Packages
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