Hermetic Packages for Integrated Circuits
Ceramic Metal Seal Flatpack Packages (Flatpack)
K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B)
10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A
-A-D -BPIN NO. 1
ID AREA b E1
0.004 M H A-B S Q D S S1
0.036 M H A-B S D S C E -D-A
-C-HL E2
E3 SEATING AND
BASE PLANE c1 L
E3 (c) b1
M M
(b)
SECTION A-A NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension …
