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Package Intersil K10.A

ManufacturerIntersil
SeriesCFP
Part NumberK10.A

MIL-STD-1835 CDFP3-F10(F-4A, Config B)10 Lead Ceramic Metal Seal Flatpack PKG

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits
    Ceramic Metal Seal Flatpack Packages (Flatpack)
    K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B)
    10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A
    -A-D -BPIN NO. 1
    ID AREA b E1
    0.004 M H A-B S Q D S S1
    0.036 M H A-B S D S C E -D-A
    -C-HL E2
    E3 SEATING AND
    BASE PLANE c1 L
    E3 (c) b1
    M M
    (b)
    SECTION A-A NOTES:
    1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
    area shown. The manufacturer’s identification shall not be used
    as a pin one identification mark. Alternately, a tab (dimension k)
    may be used to identify pin one.
    2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
    3. This dimension allows for off-center lid, meniscus, and glass
    overrun.
    4. Dimensions b1 and c1 apply to lead base metal only. Dimension ...

Parametrics

FamilyCFP
Height max0.12 inch
Length0.26 inch
Package IndexK10.A
Pin Count10
Pitch0.05 inch
Weight0.403 g
Width0.26 inch

Moldel Line

Series: CFP (17)

Manufacturer's Classification

  • Hermetic Packages
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