Mil-Std-1835 CDFP3-F14(F-2A, Config B)14 Lead Ceramic Metal Seal Flatpack PKG
Package Outline Drawing (POD)
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Hermetic Packages for Integrated Circuits
Ceramic Metal Seal Flatpack Packages (Flatpack)
K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1
ID AREA -A-D -B-S1
b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 -b 0.015 0.022 0.38 0.56 -b1 0.015 0.019 0.38 0.48 -c 0.004 0.009 0.10 0.23 -c1 0.004 0.006 0.10 0.15 -D -0.390 -9.91 3 E1
0.004 M H A-B S Q D S 0.036 M H A-B S D S C E -D-A
E3 SEATING AND
BASE PLANE c1 L
E3 (c) M
SECTION A-A NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturerвЂ™s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied. ...
|Height max||0.12 inch|