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Package Intersil K24.B

ManufacturerIntersil
SeriesCFP
Part NumberK24.B

24 Lead Ceramic Metal Seal Flatpack Package

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits
    Ceramic Metal Seal Flatpack Packages (Flatpack)
    K24.B A e 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1
    ID AREA -A-D -B-S1
    b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.070 0.115 1.78 2.92 -b 0.015 0.022 0.38 0.56 -b1 0.015 0.019 0.38 0.48 -c 0.004 0.009 0.10 0.23 -c1 0.004 0.006 0.10 0.15 -D 0.590 0.610 14.99 15.49 3 12.45 E1
    0.004 M H A-B S Q D S 0.036 M H A-B S D S C E -D-A
    -C-HE2 L
    E3 SEATING AND
    BASE PLANE c1 L
    E3 LEAD FINISH BASE
    METAL (c) b1
    M M
    (b)
    SECTION A-A NOTES:
    1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
    area shown. The manufacturer’s identification shall not be used
    as a pin one identification mark. Alternately, a tab (dimension k)
    may be used to identify pin one.
    2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
    3. This dimension allows for off-center lid, meniscus, and glass
    overrun.
    4. Dimensions b1 and c1 apply to lead base metal only. Dimension
    M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate ...

Parametrics

FamilyCFP
Length0.60 inch
Package IndexK24.B
Pin Count24
Weight1.72 g
Width0.50 inch

Moldel Line

Series: CFP (17)

Manufacturer's Classification

  • Hermetic Packages
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